Assistant Engineer

What you will be doing:

• Support development and optimization of Die Bond and Wire Bond assembly processes for new product introductions (NPI).
• Plan and execute engineering builds, DOE (Design of Experiments), and process characterization activities.
• Collect, analyze, and interpret engineering data from process trials and qualifications.
• Generate technical reports, qualification summaries, and presentations.
• Support evaluation and qualification of new Die Bond and Wire Bond equipment.

What will you bring along:

• Diploma in Engineering (Semiconductor Technology, Microelectronics, Mechanical, Electrical, Electronic, Chemical Engineering, Science)
• Minimum of 2 years of relevant working experience.
• Basic understanding of semiconductor assembly and packaging processes.
• Knowledge of Die Bond and Wire Bond processes, SPC, DOE, and problem-solving methodologies.
• Strong analytical, communication, and teamwork skills.
• Proficient in Microsoft Office applications and data analysis tools.
• Able to work independently and in a fast-paced R&D environment.

What can we offer you for your talent:

Vishay offers a comprehensive suite of benefit programs including health care coverage, financial support programs and other resources designed to help you achieve your personal and professional goals. With us, you'll experience unique career paths, an open and collaborative culture, a stable business that will be there for you, and opportunities to work globally and locally.

Do you have the skills we need? Are you ready to power your career as you power the world? If so, apply today.

Vishay is committed to a workplace free of harassment and unlawful discrimination. We do not engage in discrimination or harassment based on sex, race, color, religion, national origin, disability, protected veteran status, age, or any other characteristic protected by law in hiring and employment practices.