Die Attach Manufacturing Engineer- Process & Equiment

Key Responsibilities

Process Engineering

Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.

Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.

Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control).

Support NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms.

Monitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency. Drive process improvements to reduce variation and coupling loss.

Evaluate and qualify optically-compatible die attach materials (low-outgassing/UV-cure epoxies, index-matched adhesives, AuSn solder) with Materials and Optical Design Engineering.

Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing (thermal cycling, humidity, optical power/coupling loss, hermeticity, shear/pull testing, X-ray/CSAM/SAT inspection).

Support development of active alignment processes with real-time optical feedback during die bonding.

Equipment Engineering

Own equipment performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations, fiber/waveguide alignment).

Lead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding and alignment tools, including vision systems and sub-micron motion stages.

Maintain and execute preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime.

Work with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or similar) for tool upgrades, retrofits, spare parts, and technical escalations.

Drive automation, tooling, and fixture improvements for throughput and repeatability while maintaining alignment tolerances and protecting optical facets/lenses.

Support equipment capacity planning and capital equipment (CAPEX) proposals.

Cross-Functional Collaboration

Collaborate with Design, Product, Quality, and Operations teams to align die attach process capability with product requirements.

Provide technical training and guidance to manufacturing technicians and operators.

Support process/equipment documentation for internal and customer audits.

Track and report KPIs: yield, Cpk, equipment uptime, scrap rate, and cycle time.

Engage in cost reduction, lean manufacturing, and Six Sigma/continuous improvement initiatives.

Requirements

Required

Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles)

3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging

Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement

Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage)

Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)

Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy

Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs

Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances

Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals

Preferred

Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house

Exposure to active alignment and optical feedback-based die bonding (real-time power monitoring)

Experience with hermetic packaging, TECs, and laser die attach for telecom/datacom optics

Six Sigma Green/Black Belt certification

Experience with statistical software (Minitab, JMP) and MES/data systems

Familiarity with automation/robotics for sub-micron precision assembly

Cleanroom manufacturing experience

Skills & Competencies

Strong problem-solving and root cause analysis mindset

Hands-on, equipment-floor-ready with willingness to work on production lines

Effective cross-functional communication and documentation skills

Project management to drive NPI timelines and equipment installs

Comfortable in a fast-paced, metrics-driven manufacturing environment

Ability to work flexible shifts or support production as needed

Physical/Work Environment

Cleanroom/manufacturing floor environment; gowning may be required

Ability to stand for extended periods and work near production equipment

Occasional travel to supplier/equipment vendor sites for tool evaluation/training

What We Offer

Competitive salary and benefits package

Work on cutting-edge photonics packaging technology

Collaborative, cross-functional engineering environment

Career growth within process/manufacturing engineering

Lumilens is an equal opportunity employer committed to diversity and inclusion.