Electronics Process Engineering Manager

Are you ready to make an impact? Apply and share your resume with us today!

Primary Responsibilities

• Lead and develop the manufacturing engineering team supporting PCBA assembly and conformal coating processes.
• Drive continuous improvement projects to increase yield, throughput, and quality across the production line and specialized equipment.
• Monitor manufacturing KPIs (yield, first-pass yield, cycle time, scrap, escapes) to predict trends and drive proactive process changes.
• Perform DFM/DFA reviews on new product introductions and design changes, providing feedback to design engineering.
• Develop, document, and implement new manufacturing processes, work instructions, and process control plans.
• Identify, specify, and justify capital equipment for PCBA assembly, conformal coating, and related manufacturing processes.
• Support root cause analysis, corrective action, and disposition of manufacturing and quality nonconformances.
• Partner with quality, production control, and design teams to meet delivery schedules and customer quality requirements.
• Support quality engineering in process development and onsite audits
• Establish and monitor quality objectives of the production process
• Mentor and develop junior engineers in process development, root cause analysis, and mitigation

Basic Qualifications

• Candidate should have a BS degree and 12-15 years of prior relevant experience or Masters degree with 10-13 years of prior relevant experience. In lieu of a degree a High School Diploma/GED with 13 years of experience will be considered.
• Must possess or meet the eligibility to obtain (and be able to maintain) a Secret Clearance
• Previous experience working in PCBA manufacturing and process development
• Strong background in Design for Manufacturability (DFM) to optimize product designs for production efficiency.
• Candidate must be a resident of Huntsville, Alabama or be willing to relocate to the Huntsville, Alabama area.

Preferred Qualifications

• Familiarity with IPC requirements (J-STD-001 and IPC-A-610)
• Experience with electronics used on launch vehicles, targets, or missile components such as PCBAs, cable harnesses, or electro-mechanical assemblies
• Experience with Costpoint Material Planning software and/or Windchill product lifecycle management software is a plus.
• Experience working in a mid to high volume manufacturing environment

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo — because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 — and moving faster than anyone else dares.

Original Posting:

October 1, 2026

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $116,350.00 - $210,325.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.