NXP

External Package Innovation Engineer

Malaysia · Work style not stated · Full time

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About the role

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EmployerNXP
LocationMalaysia
Work styleWork style not stated
Employment typeFull time
Employer posted5 Aug 2026

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹 Role Overview

As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.

🔹 Key Responsibilities

✅ 1. Role Owner (Strategic & Governance)

Own and lead OSAT-wide and cross-OSAT initiatives
Define and deploy standard development templates and success criteria across OSATs
Drive deployment of Best Known Methods (BKM) and lessons learned
Develop and maintain technology roadmap and capability assessment for each OSAT site
Provide Package Innovation (PI) input for:

External site sourcing strategy
Site selection process (jointly with interface manager)

Show full description

Lead project governance, including:

Overall project summaries
Stoplight reporting
Regular reviews per OSAT site

✅ 2. Supporter (Execution & Project Delivery)

Support NPI & NTI projects executed at external OSAT factories
Ensure OSAT compliance with:

Development processes
Required documentation/templates

Drive alignment on SME (Subject Matter Expert) assignment at OSAT
Support and resolve technical and project issues on-site and across time zones
Ensure assembly readiness and safe production launch

🔹 Stakeholder Collaboration

You will work closely with cross-functional teams, including:

Project Leaders & Development Managers
Designers & Materials Engineers
Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
API and WLP/PLP/FC SMEs
OSAT partners

🔹 What We’re Looking For

Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
Proven ability to manage cross-site, cross-functional projects
Solid understanding of NPI/NTI development flows
Excellent stakeholder management and communication skills
Ability to drive standardization, governance, and technical problem-solving

🌟 Why Join Us

Opportunity to lead high-impact package innovation initiatives
Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
Drive technology roadmap and next-generation packaging solutions

More information about NXP in Malaysia...

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