NXP
Internship - Reliability of Advanced Semiconductor Packages
Netherlands · Work style not stated · Full time
Apply on the employer’s site ↗See how well you match this job
You apply directly with the employer. ROLIVA does not submit applications from this page and is not the employer.
About the role
Description from the employer’s posting. Check the employer’s page for the current version.
- EmployerNXP
- LocationNetherlands
- Work styleWork style not stated
- Employment typeFull time
- Employer posted
Understanding the reliability of advanced laminate-based electronic packages at NXP
We are looking for a highly motivated student that will help us with investigating and understanding the boundaries of the reliability of advanced laminate-based electronic packages with complex multi-material interfaces. These packages may be exposed to humidity with electrical bias and/or thermo-mechanical loading over long durations. It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g. automotive and industrial).
Your team
This opportunity is within the Product Quality & Diagnostic Center (PDQC) team. PDQC’s mission is to ensure robust product quality and reliability throughout development and qualification, enabling successful introduction of new technologies into production. PDQC accomplishes this mission through several key objectives:
Show full description
·Drive product qualification and reliability assessment for new technology developments.
·Support failure analysis and root cause understanding across development and qualification phases.
·Define and implement reliability test methods, hardware, and evaluation strategies.
·Enable continuous improvement of product robustness through data-driven insights and collaboration.
What’s in it for you
·A great opportunity to develop your skills (technical, soft skills, communication, etc.).
·Gaining experience in a multinational and diverse environment.
·Working on real assignments which contribute to NXP’s objectives.
Your Profile
·Internship for Master of Science in Microelectronics
·Affinity with semiconductor, reliability and physics.
·Team player, willing to work in international and multi-disciplinary teams.
·Flexible and able to multi-task.
·Excellent communication skills, both verbal and written in English.
More information about NXP in the Netherlands...
#LI-3623
Check your resume against this job Free, no sign-up. Nothing you paste is stored.
Staying safe while you apply
- Never pay to apply, interview or accept an offer. ROLIVA never asks you for payment to apply to a job.
- Apply only through the official “Apply on the employer’s site” button, on the employer’s own site, and check that a recruiter’s email uses that employer’s own domain rather than a free email address.
- Be cautious of an offer made with no real interview, or pressure to decide quickly or share financial details early.
Does something look wrong with this listing? Use “Report broken link” in the role details, or read ROLIVA’s full job-safety guidance ↗.
Preparing for this role with ROLIVA
- Check the fit.
Compare the requirements with the experience you have confirmed, including gaps.
- Prepare honestly.
Build interview stories and application drafts from your own evidence.
- Keep track.
Save the role and record your own application status and follow-ups.
At a glance
- Employment typeFull time
- SeniorityIntern
- Employer posted
- Added to ROLIVA
- Last checked