Packaging Integration Engineer

Essential Responsibilities include:

Own the definition, design, and qualification of optical packaging architectures forSiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.

Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).

Performmultiphysicssimulations (thermal, mechanical, optical) tooptimizepackage performance and reliability.

Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.

Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.

Present technical updates and roadmaps to internal stakeholders and external partners.

Other Responsibilities

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

Travel up to25% to other GlobalFoundries facilitiesor external partner sitesmay be necessary.

Required Qualifications

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering,OpticalEngineeringor related field.

8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.

Hands-on experience with fiberattachprocesses, photonic alignment, and optical coupling techniques.

Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.

Understanding ofreliability standards and qualification methodologies for optical modules.

Excellent analytical, problem-solving, and communication skills.

Experience in bringing packaged products from development into production.

Strong written and spoken English communication skills.

Preferred Qualifications

Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).

Knowledge of co-packaged optics (CPO), pluggable modules, and siliconphotonicsecosystems.

Expertisein chip package interaction for 2D,2.5D, 3D, 3.5DSiPhadvanced packaging.

Strong background in thermal/mechanical modeling and optical simulation tools (e.g.,Lumerical, COMSOL).

Familiarity with GF’sFotonix™ platform, including300mmmonolithicSiPhintegration and advanced packaging flows.

Experience working with OSATs and managing external development partners.

Demonstrated ability to lead cross-functional teams and influence technical direction.

Expected Salary Range

$143,000.00 - $247,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law