Principal Engineer Process Engineering

The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level),do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.

Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.

Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.

To work closely with equipment team to improve equipment productivity indices

Resolve complex technical issues in own Module or yield related issues.

Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.

Sustain and improve process / SPC to meet quality, cost, productivity requirements

To coach and develop other engineers on advance packaging Etch processes knowledge.

Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Related manufacturing and development experience is requested.

Required Qualifications:

BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required

Relevant working experience in Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.

Excellent verbal and written communication skills.

Strong interpersonal skills and ability to work effectively with different cultures.

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