NXP
Principal SoC Chip Lead
China · Work style not stated · Full time
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About the role
Description from the employer’s posting. Check the employer’s page for the current version.
- EmployerNXP
- LocationChina
- Work styleWork style not stated
- Employment typeFull time
- Employer posted
Responsibilities:
- End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
- Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.
- Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.
- Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
- Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
- Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.
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Requirements:
- Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
- 6+ years of semiconductor industry experience.
- Proven experience in SoC development from architecture through tape-out.
- Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
- Experience leading large cross-functional engineering teams.
- Strong project execution, planning, and risk management skills.
- Excellent communication, leadership, and stakeholder management capabilities.
- Ability to influence technical direction and drive execution in a matrix organization.
Preferred Qualifications:
- Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader
- Experience with automotive, industrial, or safety-critical semiconductor products.
- Experience working with global development teams across multiple sites.
- Successful delivery of multiple SoC tape-outs and post-silicon product ramps.
Core Competencies:
- Technical Leadership
- Cross-functional Collaboration
- Project Execution Excellence
- Risk Management
- Strategic Thinking
- Problem Solving & Decision Making
- Stakeholder Management
- Communication & Influence
- Customer Focus
- Results Orientation
More information about NXP in Greater China...
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At a glance
- Employment typeFull time
- SeniorityLead / Principal
- Employer posted
- Added to ROLIVA
- Last checked
Skills in this posting
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