Analog Devices

Senior Engineer, Semi Packaging Engineering

Taiwan · Work style not stated · Full time

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About the role

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EmployerAnalog Devices
LocationTaiwan
Work styleWork style not stated
Employment typeFull time
Employer posted24 Sep 2026

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to:

Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.

Show full description

Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.

Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.

Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.

Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.

Develop and maintain package design guidelines, process specifications, and technical documentation.

Qualifications

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.

2+ years of hands-on experience in semiconductor packaging development or manufacturing.

Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.

Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.

Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.

Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.

Experience with Cadence Allegro is a plus.

Strong communication skills and the ability to work effectively in cross-functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

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