Senior NPI Product Engineer

We are currently looking for a Sr. NPI Product Engineer to join our team. This role sits at the heart of new product development — engaged from product concept through end-of-life — collaborating closely with all internal cross-functional teams to drive program success. This is a unique opportunity for a passionate and driven engineer to influence key engineering and product decisions and make a meaningful impact on the cutting-edge products we deliver to our customers worldwide.

This is an exciting opportunity to work within a world-class NPI development team, focused on designing and developing advanced high-performance analog and mixed-signal semiconductor IC products in cutting-edge CMOS and BiCMOS technologies. Our products are built with purpose and precision — operating at data rates of 25–400Gbps and beyond — delivering faster, more reliable connectivity for AI data centers, PON, and 5G wireless networks. Reporting to the Manager of NPI Product Engineering, the Sr. NPI Product Engineer will take full ownership of all NPI activities — driving and executing from product concept through final product release while maintaining the product life cycle.

Responsibilities

1. NPI Program Leadership & Cross-Functional Collaboration (25%)

• Lead and drive all NPI activities from product concept through final product release while ensuring product conformance to specifications, and seamless transfer to full-volume manufacturing
• Collaborate with internal cross-functional teams including Project Lead, Design, Marketing, Validation, Test Engineering, Characterization, Quality & Reliability, Applications Engineering and Operations to ensure successful product development and delivery
• Actively participate in the milestone reviews of NPI program logistics, timelines, and milestones, providing regular updates to management and stakeholders
• Prepare all NPI product release and OSAT related manufacturing documentations for production transfer and product maintenance
• Mentor and provide technical guidance to junior product engineers

2. Design for Testability/Manufacturability (35%)

• Lead team to define Design for Manufacturability (DfM) and Design for Testability (DfT) requirements for NPI products and provide feedback to design for implementation to ensure comprehensive and efficient production test coverage
• Support test engineers in the development, implementation, verification and optimization of ATE test programs ensuring the testability/manufacturability features are considered and implemented, and that test coverage and quality is achieved while maintaining accurate cost models
• Lead product characterization, correlation and release activities, ensuring all datasheet specifications are validated and met

3. Characterization, Data Analysis & Yield Optimization (30%)

• Develop comprehensive product characterization plans encompassing both wafer-level and bench characterization tests, ensuring thorough test coverage across all product specifications and operating conditions
• Conduct rigorous data analysis of ATE and bench characterization results across process, voltage, and temperature (PVT) variations, including ATE-to-bench correlation studies, PCM data analysis, process capability analysis to ensure product conformance to specifications and yield modeling for new products
• Plan and execute Design of Experiments (DOE) to optimize product performance, drive yield analysis, test time reduction, and test optimization efforts — identifying and resolving yield limiters in close collaboration with Design, Test, Quality, and Foundry Process teams
• Contribute to product validation and reliability qualification plans working closely with Test, Characterization, Validation, and Reliability Engineering teams to ensure alignment and successful execution

4. Manufacturing Quality, Failure Analysis & Continuous Improvement (10%)

• Work with foundry process/packaging engineering in the resolution of problems that occur during wafer fabrication, packaging, die sort and final package test processes
• Drive the resolution of failure analysis, root cause and corrective actions for field returns
• Monitor and maintain product life cycle, identifying opportunities for cost reduction and continuous improvement

Minimum Qualifications:

• BSc in Electrical Engineering or related field and a minimum of 8 years relevant work experience.
• Experience in semi-conductor technology, product, test and/or design engineering.
• Experience with quality systems including corrective actions, 8D reports, non-conformance reports, and failure analysis reports.
• Knowledge and experience with statistical theory and data analysis tools (e.g. Excel, JMP, Galaxy, dataConductor) for design of experiments, yield reporting and modelling.
• Experience in high-speed digital ATE test platforms (e.g. Advantest, Teradyne) or equivalent rack solutions is an asset.
• Strong knowledge of high-speed serial digital interconnect components and test methodologies
• Experience with JEDEC, and/or Mil quality requirements.

This job description intends to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.