Senior Principal Foundry Engineer - HV/BCD Process Integration

Operations 3rd Party Foundries :
- Co-ordinate all Wafer Manufacturing related activities.
- Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.
- Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions
- Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.
Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.

Program management 3rdParty Foundries:
- Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project
- Be responsible for monitoring and controlling the execution of the project as per agreed time-line
- Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry
- Actively coordinate process qualification, product introduction and qualification
- Stimulate/oversee structural problems solving by use of statistical and quality tools
- Chair and organize process gate meetings
- Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)
- Be the interface between NXP and External Foundries during project execution
- Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities