Lumilens

Senior/Staff Process Engineer (Wafer Dicing & Back-grind)

Singapore, Singapore, Singapore · Work style not stated · FullTime

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About the role

Description from the employer’s posting. Check the employer’s page for the current version.

EmployerLumilens
LocationSingapore, Singapore, Singapore
Work styleWork style not stated
Employment typeFullTime
Employer posted8 hours ago

Core Responsibilities

Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.

Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers.

Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage.

Monitor wafer thickness uniformity, cutting quality and production capacity, carry out continuous process optimization to improve product yield.

Evaluate process compatibility between wafer grinding/stealth dicing and bumping & flip-chip processes, optimize process integration to avoid subsequent process failure attributed to front-end process variations.

Show full description

Compile process SOP, WI, failure reports and engineering change documents; support NPI new product introduction and process verification.

Key Requirements & Qualification

Education: A Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.

Experience: 3 to 6+ years of hands-on process engineering in wafer mounting, stealth dicing, wafer grinding, especially in handling advanced packaging wafers with more complex topology or stack.

Experience working with external equipment and material suppliers to develop equipment and materials needed to support new assembly requirements. Characterize, qualify and bring the process up for mass production.

Familiarity with SPC, JMP data analysis, and DOE matrix design for process development and problem identification and solving using meticulous fixing methods.

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