Renesas Electronics

Sr. Staff Power Module Design Engineer

Zhubei, Hsinchu County, Taiwan · On-site · Full-time

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About the role

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EmployerRenesas Electronics
LocationZhubei, Hsinchu County, 302, Taiwan
Work styleOn-site
Employment typeFull-time
Employer posted4 hours ago

We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation.

Key Responsibilities

Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications.
Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module.
Conduct PDN extraction for the module package to assess power path losses and switch-node ringing.
Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products.
Build and run module thermal models to ensure all components remain below maximum operating temperatures.
Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance.
Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.

Show full description

BSEE or MSEE with 5+ years of hands-on power electronics design experience.
Strong experience designing high-current, high-frequency DC-DC converters, especially multiphase buck architectures.
Direct experience designing power modules, VRMs, or highly integrated power solutions is strongly preferred.
Deep understanding of power stage design and magnetics for high-current applications.
Hands-on experience in PCB layout for high-current-density and high-frequency applications.
Proficiency with design and simulation tools:
PCB layout: Cadence/Altium Designer
Circuit simulation: SIMPLIS / SIMetrix
PDN extraction and magnetic design: Q3D / PowerSI / Maxwell
Thermal simulation: Flotherm / Icepak
Proven ability to debug complex power circuits through lab measurement and root-cause analysis.
Ability to collaborate effectively across IC design, packaging, reliability, and manufacturing teams.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

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