System Mechanical & Integration Engineer

Key Responsibilities

In this role, your focus will be on hands-on mechanical and thermal development of power systems, with ownership commensurate with level and increasing responsibility over time.

• Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB).
• Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations.
• Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials.
• Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability.
• Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features.
• Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components.
• Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements.
• Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues.
• Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions.
• Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement.

Required Qualifications

• MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field.
• 3+ experience with Strong foundation in multiple areas spanning:

• Mechanical design and product development
• Thermal management of electronic systems
• System integration of power electronics platforms
• Candidates with additional experience may be considered at the Senior Engineer level

• Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
• Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA.
• Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
• Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
• Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
• Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting.

Preferred Qualifications

• Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems.
• Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware.
• Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+.
• Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management.
• Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations.
• Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification.
• Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes.
• Python or MATLAB experience for thermal data analysis, automation, and model correlation.
• Strong communication skills and ability to work effectively in multidisciplinary engineering teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $110,385 to $151,808.

Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.