Technician 3, Production

Metallization Process (20%):

• Operate metal deposition tools including e-beam evaporation systems.
• Execute metal stack deposition for p-contacts, n-contacts, and device interconnects.
• Perform metal lift-off processes and inspect pattern quality.
• Monitor film thickness and deposition uniformity.
• Maintain process documentation and support troubleshooting of metallization-related issues.

Wet and Dry Etch Processing (20%):

• Perform wet chemical etching for InP and related III-V semiconductor materials.
• Operate dry etch systems such as RIE or ICP tools for pattern transfer and device definition.
• Monitor etch rates, profiles, and uniformity.
• Maintain chemical safety procedures and proper handling of process gases and chemicals.
• Support optimization and troubleshooting of etch processes.

Photolithography Process and SEM Support (15%):

• Support photolithography processes including resist coating, exposure, and development.
• Assist in mask alignment and lithography process setup for device fabrication.
• Operate Scanning Electron Microscopy (SEM) for pattern inspection, feature verification, and process qualification.
• Perform basic inspection and process monitoring to ensure pattern quality.
• Work closely with process engineers to maintain stable lithography operations.

Process Module Ownership and Fab Support (10%):

• Own and manage assigned process modules within the wafer fabrication line.
• Monitor tool performance, uptime, and process stability.
• Assist with preventive maintenance and troubleshooting equipment.
• Maintain process documentation and support continuous improvement initiatives.

Minimum Qualifications:

• Associate’s degree preferred.
• Minimum 10 years of hands-on experience in InP wafer fabrication processing.
• Direct experience with DFB laser and gain chip wafer fabrication in a compound semiconductor manufacturing environment.
• Strong expertise in InP-based III-V semiconductor fabrication processes.
• Hands-on experience with DFB grating fabrication using holographic lithography techniques.
• Proficiency in Atomic Force Microscopy (AFM) for grating and surface characterization.
• Experience with e-beam evaporation and metallization lift-off processes.
• Strong knowledge of wet chemical etching and plasma dry etching of InP materials.
• Ability to manage and operate multiple wafer fab process modules.
• Strong troubleshooting and problem-solving skills in a cleanroom environment.
• Familiarity with semiconductor manufacturing documentation, safety practices, and process control.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

A reasonable estimate of the pay range for this position is $27 - $39/hr. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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