Wafer Fab Equipment Engineer

This is an ideal position for a self‑directed, technically strong, and collaborative engineer who enjoys hands‑on equipment work, root‑cause problem solving, and operating in a structured cleanroom production environment. The work environment is a mix of office and cleanroom settings, within a collaborative, supportive, and engaging team culture.

Primary Duties & Responsibilities:

• Own and support assigned wafer fabrication tools and associated subsystems used in low-rate production
• Troubleshoot, diagnose, and resolve equipment issues impacting safety, yield, schedule, or throughput
• Drive equipment reliability improvements through root cause analysis and corrective/preventive actions
• Partner with Process Engineers to ensure tools meet process capability and control requirements
• Support hands‑on wafer processing and recovery activities for production lots as needed
• Collect, analyze, and trend equipment performance metrics (OEE, Uptime, MTBF, MTTR, repeat failures)
• Improve equipment diagnostics, automation, and recovery procedures to reduce unplanned downtime
• Document equipment procedures, configurations, and workflows in MES‑ready formats
• Ensure compliance with safety, cleanroom, and EHS requirements
• Collaborate with Process, Maintenance, Quality, and R&D teams to support stable low-rate production execution

Job Qualifications:

• Minimum Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline
• 1–5 years of relevant experience supporting semiconductor, MEMS, or microfabrication equipment
• Familiarity with equipment metrics (MTBF, MTTR, OEE), SPC concepts, or structured escalation workflows
• Strong written and verbal communication skills in English
• Proficient computer skills, including JMP, Microsoft Word, Excel
• Strong troubleshooting, root‑cause analysis, and problem‑solving skills
• Ability to work hands‑on with semiconductor fabrication equipment, including vacuum systems, RF plasma systems, motion control, and wet processing tools
• Experience with one or more key wafer fabrication processes
• Experience using basic inspection and diagnostic tools (e.g., microscopes, electrical test equipment; SEM/FIB exposure a plus)
• Familiarity with cleanroom operations, safety practices, and controlled manufacturing environments
• Must be a U.S. Citizen or Permanent Resident

Desired Background

• Exposure to infrared detectors, focal plane array, or imaging device fabrication
• Experience developing and executing preventive maintenance strategies

Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)

Salary Range:

$113,600.00-$151,400.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​