Lumilens
Wire Bond-Manufacturing Engineer
Singapore, Singapore, Singapore · Work style not stated · FullTime
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About the role
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- EmployerLumilens
- LocationSingapore, Singapore, Singapore
- Work styleWork style not stated
- Employment typeFullTime
- Employer posted
About Lumilens
At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.
Job Description
We are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).
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Key Responsibilities
Process Engineering
Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems
Establish and maintain process specifications, bond recipes, work instructions, and control plans
Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects
Support NPI by developing new wire bond process flows, including DOE-driven process windows
Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)
Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving
Equipment Engineering
Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)
Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)
Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders
Collaborate with equipment vendors for technical escalations and upgrades
Plan preventive maintenance and spare parts strategy
Quality & Reliability
Partner with Quality and Reliability teams on failure analysis for field and customer returns
Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions
Ensure compliance with IPC/JEDEC standards and customer requirements
Cross-Functional Collaboration
Work closely with Product/Design Engineering for bond pad layout and substrate design
Partner with Process Integration, Test, and Quality to resolve yield and reliability issues
Support cost reduction initiatives and train operators/technicians on process and equipment
Documentation & Compliance
Maintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100)
Support internal and customer audits related to wire bond processes and equipment
Requirements
Required:
Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering
3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)
Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes
Experience with DOE, SPC, and root cause/CAPA methods
Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)
Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)
Strong analytical, troubleshooting, and cross-functional communication skills
Willingness to support shift or production floor needs
Preferred:
Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging
Exposure to copper wire bonding and associated process/reliability considerations
Experience with fine-pitch wire bonding (<50 µm) and multi-tier/stacked die bonding
Six Sigma Green/Black Belt certification
Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems
Cleanroom manufacturing experience
What We Offer
Competitive salary and benefits package
The opportunity to work on cutting-edge semiconductor packaging technology
A collaborative, cross-functional engineering environment
Career growth within the manufacturing/process engineering track
Lumilens is an equal opportunity employer committed to diversity and inclusion.
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At a glance
- Employment typeFullTime
- Employer posted
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